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India Signs Financing Agreement with World Bank for US$ 201.50 Million for “Third Technical Education Quality Improvement Programme (TEQIP III)”

News and Press Release - Dated:- 2-2-2017 - A Financing Agreement for IDA credit of US$201.50 million (equivalent) for the Third Technical Education Quality Improvement Programme (TEQIP III) was signed with the World Bank here yesterday. The Financin .....

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o enhance quality and equity in participating Engineering Education Institutes and improve the efficiency of the Engineering Education System in Uttarakhand, Himachal Pradesh, Bihar, Uttar Pradesh, Madhya Pradesh, Chhattisgarh, Rajasthan, 8 North Eas .....

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