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India Signs Financing Agreement with World Bank for US 201.50 Million for Third Technical Education Quality Improvement Programme (TEQIP III)

News and Press Release - Dated:- 2-2-2017 - A Financing Agreement for IDA credit of US$201.50 million (equivalent) for the Third Technical Education Quality Improvement Programme (TEQIP III) was signed with the World Bank here yesterday. The Financing Agreement was signed by Mr. Raj Kumar (Joint Secretary, Department of Economic Affairs) on behalf of Government of India and Mr. Junaid Kamal Ahmad, Country Director, World Bank (India) on behalf of the World Bank. The objective of the Program is t .....

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