9911796707
TMI BlogSeeks to further amend notification No 25/98-Customs dated 2nd June 1998 to update the classification of the goods in the notification.X X X X Extracts X X X X X X X X Extracts X X X X ..... 5/1998-Customs, dated the 2nd June, 1998, Published in the Gazette of India, Extraordinary, Part II, section 3, sub-section (i), vide G.S.R. 290(E), dated the 2nd June, 1998, namely:- In the said notification, - (i) in the opening paragraph, for the words "sub-heading Nos.", the words "heading, sub-heading or tariff item" shall be substituted; (ii) for the TABLE, the following TABLE shall be substituted, namely: - "TABLE S. No. Heading or Sub-heading or tariff Item Description (1) (2) (3) 1. 7017 10 00 or 7020 00 Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of semi-conductor wafers. 2. 8419 89 or 8486 Chemical vapour deposition apparatus for semi-conductor pro ..... X X X X Extracts X X X X X X X X Extracts X X X X ..... 486 Grinding, polishing and lapping machines for processing of semiconductor wafers. 15. 8464 90 00 or 8486 Dicing machines for scribing or scoring semiconductor wafers. 16. 8466 91 00 or 8486 Parts of grinding, polishing and lapping machines for processing of semiconductor wafers. 17. 8466 91 00 or 8486 Parts of machines for sawing monocrystal semiconductor boules into slices, or wafers into chips. 18. 8466 91 00 or 8486 Parts of dicing machines for scribing or scoring semiconductor wafers. 19. 8466 93 or 8486 Parts of focussed ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices. 20. 8466 93 or 8486 Parts of machines for working any material by removal of material, by l ..... X X X X Extracts X X X X X X X X Extracts X X X X ..... ns on semiconductor wafers. 35. 8479 90 or 8486 Parts of apparatus for growing or pulling monocrystal semiconductor boules. 36. 8479 90 or 8486 Parts of epitaxial deposition machines for semiconductor wafers. 37. 8479 90 or 8486 Parts of apparatus for physical deposition by sputtering on semiconductor wafers. 38. 8479 90 or 8486 Parts for die attach apparatus, tape automated bonders and wire bonders for assembly of semiconductors. 39. 8479 90 or 8486 Parts of spinners for coating photographic emulsions on semiconductor wafers. 40. 8479 90 or 8543 90 00 or 8486 Parts of apparatus for wet-etching, developing, stripping or cleaning semiconductor wafers and flat panel displays. 41. 8479 90 or 8486 Parts of automated machine ..... X X X X Extracts X X X X X X X X Extracts X X X X ..... cing masks or reticles from photoresist coated substrates. 55. 8486 20 00 Apparatus for the projection or drawing of circuit patterns on sensitised semiconductor materials. 56. 8486 90 00 Parts and accessories of the apparatus of heading Nos. 901041 to 901049 57. 9011 10 00 Optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles. 58. 9011 20 00 Photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles. 59 9011 90 00 Parts and accessories of optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semicond ..... X X X X Extracts X X X X X X X X Extracts X X X X
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